Your new company

A leading global player in semiconductor design and manufacturing is currently hiring a Packaging Engineer to join its high-tech operations in Melaka. Renowned for its innovation in analog ICs and embedded processing solutions, the company is dedicated to shaping the future of electronics through sustainable practices, advanced engineering, and a strong commitment to employee development.

Your new role

• Optimize high-speed process parameters for component attach, stack-up, and molding (transfer or compression)
• Define simplified manufacturing sequences for component integration
• Manage new product execution from kickoff to release-to-market (prototyping, characterization, qualification)
• Collaborate with factory operations to meet production, quality, and cost targets
• Work with global packaging and technology teams to implement advanced process capabilities
• Drive competitiveness in leaded module packaging using latest industry practices
• Operate equipment and select materials for process optimization and yield improvement
• Mentor technicians and support continuous improvement initiatives

What you'll need to succeed

• Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or related field
• Minimum 8 years of experience in semiconductor packaging
• Expertise in module package design and stack-up
• Proficient in SMT and back-end packaging processes (flip chip, underfill, molding, singulation, trim & form)
• Skilled in FMEA, SPC, DOE, and statistical analysis (JMP preferred)
• Experience in multi-process coordination and SiP integration
• Strong project management background in Assembly Test or SMT operations

What you'll get in return

What you need to do now